End-to-end VLSI design solutions
From architecture through RTL, verification, DFT, physical design and silicon bring-up — we deliver every stage with execution excellence, as a full-flow team or a targeted specialist engagement.
From specification to GDSII
Our design team is proficient in defining SoC architecture and IP micro-architecture, developing IPs from scratch, integrating third-party IP and taking designs through synthesis, timing closure and physical implementation.
- Architecture development, PPA analysis and technology-node selection
- RTL design, IP integration, Lint / CDC / RDC and low-power (UPF)
- Synthesis, STA and physical design through signoff
Architecture
Right-sized SoC and chiplet architectures that meet PPA targets.
RTL Design
Clean, synthesis- and DFT-ready RTL with full static checks.
Synthesis & STA
Constraint development, PPA optimisation and multi-corner signoff.
Physical Design
Floorplan to GDSII with predictable timing closure.
Confidence before tape-out
We define the right verification strategy for your scope — IP, subsystem or SoC — and execute with coverage-driven UVM, formal and emulation to deliver first-pass silicon.
- Verification planning, UVM environments, VIPs and reference models
- Code, functional and assertion coverage closure; formal property checking
- Gate-level, power-aware and SoC C-based verification; emulation
UVM
Reusable, layered testbenches from IP to SoC.
Formal
Exhaustive proofs for control logic and protocol compliance.
Coverage
Metric-driven closure with transparent reporting.
Emulation
Palladium / Zebu / Veloce for SoC-level software bring-up.
High coverage, low DPPM
Our DFT team devises custom test architectures that deliver very high test coverage, excellent yield and a thorough screen for manufacturing defects — for monolithic die and chiplet-based multi-die designs.
- Test architecture, test-mode definition and IO mux schemes
- Scan with compression, MBIST / LBIST, boundary scan (IEEE 1149.1 / 1687)
- ATPG, pattern validation, test-mode STA and ATE bring-up support
Scan
Compression architectures tuned for pattern count and power.
MBIST
Memory test and repair for every memory instance.
Boundary Scan
JTAG / IJTAG infrastructure for board and die-to-die test.
ATPG
Stuck-at, transition and path-delay patterns with ATE translation.
From first sample to production
When a wafer or chip arrives, our bring-up experts get silicon running fast, debug and isolate real design issues from setup or environment artefacts, and build the firmware that brings your product to life.
- Silicon bring-up, validation planning and execution, characterisation
- Silicon debug across ATE, bench and system environments
- Bare-metal, RTOS and Linux firmware, drivers, bootloaders and BSPs
Bring-Up
Day-one readiness with validated boards, firmware and test content.
Debug
Isolate design issues from test, board and environment factors.
Firmware
Drivers, bootloaders and BSPs for ARM and RISC-V SoCs.
Characterisation
Performance, power and margin analysis across PVT.
Work with us the way that fits your program
Staff augmentation
Senior engineers embedded in your team — onsite at your facility, hybrid or remote — ramped on your flows within days.
Managed teams
A dedicated I2Intech team with a single technical lead and defined deliverables, metrics and reporting cadence.
Turnkey deliverables
Fixed-scope ownership of a block, flow or milestone — from verification closure to tape-out ready GDSII.
Have a program that needs execution excellence?
Tell us about your scope and timeline — we'll propose a team and plan within days.